Electronic Packaging & Materials
Enclosures, Racks, Cabinets, Instrument Cases, Thermal Interface Materials, Adhesives, Tapes, Rubber Products, EMI / RFI Shielding, & RF Absorption Materials, Insulation Thermoset Composite Materials
General Devices offers the industry's most complete selections of electronic packaging hardware, as single components or as complete packaging solutions. Our products are designed for use in electronics/computer, telecom/datacom, broadcast, audio/visual, medical, aerospace, military, security, transportation, fire and emergency vehicles, recreational vehicles, service work truck and equipment vehicles, bus transport vehicles, and other leading industries and markets.
Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. As a leader in the design, supply and support of innovative technology, our products and solutions allow people, organizations, machines and applications to connect effectively, helping to build a world where smart technology transforms the way of life.
nVent’s Schroff brand and nVent’s Calmark Birtcher’s brand offers innovative solutions for embedded computing systems including a broad portfolio of products including accessories for protecting printed circuit board (PCB) – from card retainers, conduction cooled frames, front panels, and handles to sub-racks, cases, backplanes, power supplies, cabinets, and pre-assembled chassis.
The Gund Company has grown into one of the largest manufacturers and fabricators of thermoset composite materials based on our understanding of both materials and their application. Our customers will find our materials knowledge and application experience to be a useful resource in solving today's engineering challenges. The Gund Company now has 8 locations in the United States, Canada, Mexico and China.